技术参数
AC适配器:   18.7 x 14.5 x 7.7 in / 19.4 lb
环境工作温度:   10 to 40 C / 50 to 104 F

峰值功率:   150 W per tool � 23.5 V

焊嘴与接地间电阻:   <2 ohms

焊嘴与接地间电压:   <2 mV RMS

Selectable Temperature:   90 to 450 C / 190 to 840 F

Max. and min. temperature:   Limit the temperature range in which the operator is allowed to work.

Voltage (AC):   ref. DDPE-1QB - 120 V

Package:   474 x 368 x 195 mm / 8.79 kg

Temperatue levels:   Instant selection of up to 3 editable temperature settings for solder joints with different heat requirement.

PIN protection:   Keep station parameters protected against unauthorized access.

Sleep and Hibernation mode:   These modes lower soldering tip temperature when the tool rests in the stand in order to avoid oxidation and extending tip life.

Control Unit:   See individual modules

USB-B (rear):   Software PC / Traceability

USB-A (front):   Firmware update Soldering Graphics management

Robot:   RS-232 remote control or Smart Fume Extractor connection.
Dynamic Soldering Profiles:   Designed to avoid thermal shock when soldering Ceramic Chip components like MLCC, this new and unique feature

Soldering graphics:   Real time visualization of tip temperature and power delivered to the solder joint during soldering process.

10 user interface languages:   English, German, Spanish, French, Italian, Portuguese, Russian, Japanese, Korean, Chinese.